Product Code: Xeon® Gold 6144
Availability: In Stock
3 045.00€

General information
TypeCPU / Microprocessor
Market segmentServer
Family
Intel Xeon Gold
Model number  ? 
6144
CPU part numbers
  • CD8067303657302 is an OEM/tray microprocessor
  • CD8067303843000 is an OEM/tray microprocessor
Frequency  ? 3500 MHz
Maximum turbo frequency4200 MHz
Bus speed  ? 10.4 GT/s UPI
Clock multiplier  ? 35
Package3647-land Flip-Chip Land Grid Array (FC-LGA)
SocketSocket 3647 / P0 / LGA3647-0
Size2.99" x 2.22" / 7.6cm x 5.65cm
Fan/heatsink2U form factor
Introduction dateJuly 11, 2017
Price at introduction$2925
S-spec numbers
Part numberProduction processors
 SR3MBSR3TR
CD8067303657302+ 
CD8067303843000 +
Architecture / Microarchitecture
MicroarchitectureSkylake
PlatformPurley
Processor core  ? Skylake-SP
Core stepping  ? H0 (SR3MB, SR3TR)
Manufacturing process0.014 micron
DieXCC type
Data width64 bit
The number of CPU cores8
The number of threads16
Floating Point UnitIntegrated
Level 1 cache size  ? 8 x 32 KB 8-way set associative instruction caches
8 x 32 KB 8-way set associative data caches
Level 2 cache size  ? 8 x 1 MB 16-way set associative caches
Level 3 cache size24.75 MB non-inclusive shared cache
Physical memory768 GB
MultiprocessingUp to 4 processors
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64  ? 
  • NX / XD / Execute disable bit  ? 
  • HT / Hyper-Threading technology  ? 
  • VT-x / Virtualization technology  ? 
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0  ? 
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
Low power featuresEnhanced SpeedStep technology  ? 
Integrated peripherals / components
Integrated graphicsNone
Memory controllerThe number of controllers: 2
Memory channels per controller: 3
Supported memory: DDR4-2666
DIMMs per channel: 2
ECC supported: Yes
Other peripherals
  • Ultra Path Interconnect (3 links)
  • PCI Express 3.0 interface (48 lanes)
  • Direct Media Interface 3.0 (4 lanes)
Electrical / Thermal parameters
Maximum operating temperature  ? 75°C (case temperature)
102°C (Digital Thermal Sensor)
Thermal Design Power  ? 150 Watt