Xeon® Gold 6148

General information
Type	CPU / Microprocessor
Market segment	Server
Family	Intel Xeon Gold
Model number  ?	6148
CPU part numbers	CD8067303406200 is an OEM/tray microprocessor BX806736148 is a boxed microprocessor
Frequency  ?	2400 MHz
Maximum turbo frequency	3700 MHz
Bus speed  ?	10.4 GT/s UPI
Clock multiplier  ?	24
Package	3647-land Flip-Chip Land Grid Array (FC-LGA)
Socket	Socket 3647 / P0 / LGA3647-0
Size	2.99" x 2.22" / 7.6cm x 5.65cm
Fan/heatsink	1U form factor
Introduction date	July 11, 2017
Price at introduction	$3072 (OEM) $3078 (box)
S-spec numbers
Part number ES/QS processors Production processors   QMS1 SR3B6 BX806736148   + CD8067303406200   + Unknown +
Architecture / Microarchitecture
Microarchitecture	Skylake
Platform	Purley
Processor core  ?	Skylake-SP
Core stepping  ?	H0 (QMS1, SR3B6)
CPUID	50654 (QMS1)
Manufacturing process	0.014 micron
Die	XCC type
Data width	64 bit
The number of CPU cores	20
The number of threads	40
Floating Point Unit	Integrated
Level 1 cache size  ?	20 x 32 KB 8-way set associative instruction caches 20 x 32 KB 8-way set associative data caches
Level 2 cache size  ?	20 x 1 MB 16-way set associative caches
Level 3 cache size	27.5 MB non-inclusive shared cache
Physical memory	768 GB
Multiprocessing	Up to 4 processors
Features	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ?  AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions AVX2 / Advanced Vector Extensions 2.0 AVX-512 / Advanced Vector Extensions 512 BMI / BMI1 + BMI2 / Bit Manipulation instructions F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions EM64T / Extended Memory 64 technology / Intel 64  ?  NX / XD / Execute disable bit  ?  HT / Hyper-Threading technology  ?  VT-x / Virtualization technology  ?  VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0  ?  TXT / Trusted Execution technology TSX / Transactional Synchronization Extensions
Low power features	Enhanced SpeedStep technology  ?
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 2 Memory channels per controller: 3 Supported memory: DDR4-2666 DIMMs per channel: 2 ECC supported: Yes
Other peripherals	Ultra Path Interconnect (3 links) PCI Express 3.0 interface (48 lanes) Direct Media Interface 3.0 (4 lanes)
Electrical / Thermal parameters
Maximum operating temperature  ?	86°C (case temperature) 95°C (Digital Thermal Sensor)
Thermal Design Power  ?	150 Watt